NI SBRIO 9607 嵌入式控制器

SBRIO-9607 NI SBRIO-9607 嵌入式控制器

品牌:NI P/ nSBRIO-9607

目录描述:SBRIO-9607

原产地:瑞典 

NI SBRIO-9607SCXI-1100 SCXI-1126 PXI-8186 PXI-1031等DCS/PLC，

数字/0、RMC、667 MHz双核CPU、512 MB DRAM、512 MB存、Zyng-7020 FPGA CompactRI0单板控制器-sb Rio9607是一款嵌入式控制器，在单个印刷电路板(PCB)上集成了运行NI Linux实时操作系统的实时处理器、用户可重新配置的FPGA和/0。它包括一个RIO夹层卡(RMC)连接器，这是一个高速、高带宽连接器，可以直接访问处理器和数字I/O FPGA线路。sbRio 9607旨在轻松嵌入需要灵活性、可靠性和高性能的大批量OEM应用中。该控制器集成了千兆以太网、CAN、串行和USB端口以及96条3.3 V数字I/0线路。

SBRIO-9607 NI SBRIO-9607 嵌入式控制器以CoolSiC作为商品名，目前已推出了两代产品。第一代以1200V为主，目前外于量产阶段。而第二代产品包括1200V和750V两个电压规格，相较上一代增加了25-30%的载电流能力。在针对电动汽车开发的碳化硅模块产品上，英飞凌着重扩充HybridPACK Drive系列产品，推出了尺寸和管脚兼容的的HybridPACK Drive CoolSiC。目的是充分利用前期HybridPACK Drive建立的业内知名度和客户资源，减少市场推广成本，降低客户切入的壁垒。不过为了获得更好的性能和更紧凑的万案尺寸，第二代Coo SiC也采用了业内逐渐流行的双面水冷封装HvpridPACK DSC，推出了全新的碳化硅塑封模块。

SBRIO-9607 NI SBRIO-9607 嵌入式控制器

SBRIO-9607 NI SBRIO-9607 Embedded controller

Brand: NIP/nSBRIO-9607

Directory Description :SBRIO-9607

Country of Origin: Sweden

NI SBRIO-9607SCXI-1100 SCXI-1126 PXI-8186 PXI-1031 DCS/PLC,

Digital /0, RMC, 667 MHz dual-core CPU, 512 MB DRAM, 512 MB memory, Zyng-7020 FPGA CompactRI0 single-board controller -sb Rio9607 is an embedded controller. A real-time processor running the NI Linux real-time operating system, a user-reconfigurable FPGA, and /0 are integrated on a single printed circuit board (PCB). It includes a RIO Sandwich card (RMC) connector, which is a high-speed, high-bandwidth connector that provides direct access to the processor and digital I/O FPGA lines. The sbRio 9607 is designed to be easily embedded in high-volume OEM applications that require flexibility, reliability, and high performance. The controller integrates Gigabit Ethernet, CAN, serial and USB ports and 96 3.3V digital I/0 lines.

The SBRIO-9607 NI SBRIO-9607 embedded controller, under the trade name CoolSiC, has been launched in two generations. The first generation is mainly 1200V, which is currently in mass production. The second generation includes two voltage specifications of 1200V and 750V, which increases the current carrying capacity by 25-30% compared to the previous generation. In the silicon carbide module products developed for electric vehicles, Infineon focuses on expanding the HybridPACK Drive series, introducing the HybridPACK Drive CoolSiC, which is compatible with the size and pin. The purpose is to make full use of the industry reputation and customer resources established by HybridPACK Drive in the early stage, reduce marketing costs, and reduce the barriers to customer entry. However, in order to obtain better performance and more compact size, the second generation of Coo SiC also uses the industry's increasingly popular double-sided water-cooled package HvpridPACK DSC, launched a new silicon carbide plastic sealing module.

SBRIO-9607 NI SBRIO-9607 嵌入式控制器