IS215VCMIH2BB-IS200VCMIH2BCC  印刷电路板

产品描述

IS200VCMIH2BCC是GE Mark VI印刷电路板。这是Mark VI组件。Mark VI是一种蒸汽和燃气轮机管理系统，由通用电气公司发布，作为“Speedtronic”生产线的一部分。自20世纪60年代以来，Speedtronic系列已用于涡轮机管理的各种迭代。Mark VI符合或超过许多安全和质量保证标准，包括ISO-9000-3质量管理和质量保证标准，Pt 3: ISO-9001在软件开发、供应和维护中的应用指南。

IS200VCMIH2BCC设计安装在中央控制模块的槽位之一。它的功能是作为内部通信控制卡，允许机架内或其他控制或保护模块内的I/O卡相互通信。

IS215VCMIH2BB-IS200VCMIH2BCC 印刷电路板（Printed Circuit Board，PCB）是一种用于电子设备的电路板，它通过在绝缘材料上蚀刻铜箔来形成电路图案。

IS215VCMIH2BB-IS200VCMIH2BCC PCB 的制造过程通常包括以下步骤：

1. 设计：使用电子设计自动化（EDA）软件设计电路板的电路图案。

2. 制版：将设计好的电路图案转化为光刻版，用于蚀刻铜箔。

3. 蚀刻：使用蚀刻液将铜箔蚀刻成电路图案。

4. 钻孔：在电路板上钻出连接电路图案的孔。

5. 镀覆：在电路板上镀覆金属，如铜、锡、镍等，以增强电路板的导电性和可焊性。

6. 装配：将电子元件安装在电路板上，通常使用表面贴装技术（SMT）或插件技术。

7. 焊接：使用焊接技术将电子元件与电路板连接起来。

8. 测试：对电路板进行测试，以确保其符合设计要求。

IS215VCMIH2BB-IS200VCMIH2BCC PCB 广泛应用于电子设备中，如计算机、手机、电视机、游戏机等。它的优点是可以实现高密度电路、高可靠性、高精度和低成本。

IS215VCMIH2BB-IS200VCMIH2BCC  印刷电路板

Product description

The IS200VCMIH2BCC is a GE Mark VI printed circuit board. This is the Mark VI component. The Mark VI is a steam and gas turbine management system released by General Electric as part of the "Speedtronic" line. Since the 1960s, the Speedtronic series has been used in various iterations of turbine management. Mark VI meets or exceeds a number of safety and quality assurance standards, including ISO-9000-3 Quality Management and Quality Assurance Standards, Pt 3: Guidelines for the Application of ISO-9001 in Software Development, Supply and Maintenance.

The IS200VCMIH2BCC is designed to be installed in one of the slots of the central control module. It functions as an internal communication control card, allowing I/O cards within the rack or other control or protection modules to communicate with each other.

IS215VCMIH2BB-IS200VCMIH2BCC Printed Circuit Board (PCB) is a circuit board for electronic devices that forms a circuit pattern by etching copper foil on the insulation material.

The manufacturing process for IS215VCMIH2BB-IS200VCMIH2BCC PCBS typically includes the following steps:

1. Design: Use Electronic Design automation (EDA) software to design the circuit pattern of the circuit board.

2. Plate making: The designed circuit pattern is converted into light engraving plate for etching copper foil.

3. Etching: Use etching liquid to etch copper foil into circuit patterns.

4. Drill holes: Drill holes on the circuit board to connect the circuit pattern.

5. Plating: Plating metal on the circuit board, such as copper, tin, nickel, etc., to enhance the electrical conductivity and solderability of the circuit board.

6. Assembly: The electronic components are mounted on the circuit board, usually using surface mount technology (SMT) or plug-in technology.

7. Welding: The use of welding technology to connect electronic components to the circuit board.

8. Test: Test the circuit board to ensure that it meets the design requirements.

IS215VCMIH2BB-IS200VCMIH2BCC PCB is widely used in electronic equipment, such as computers, mobile phones, televisions, game consoles and so on. Its advantages are that it can achieve high-density circuits, high reliability, high precision and low cost.