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S200VPROH2B-IS200VPROH1BEF 电源模块 用于交换设备、接入设备、移动通讯

S200VPROH2B-IS200VPROH1BEF 电源模块是可以直接贴装在印刷电路板上的电源供应器,其特点是可为专用集成电路(ASIC)、数字信号处理器 (DSP)、微处理器、存储器、现场可编程门阵列 (FPGA) 及其他数字或模拟负载提供供电。一般来说,这类模块称为负载点 (POL) 电源供应系统或使用点电源供应系统 (PUPS)。

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S200VPROH2B-IS200VPROH1BEF 电源模块 用于交换设备、接入设备、移动通讯

GE-IS200VPROH2B-IS200VPROH1BEF-IS200VPWRH1AHD--(1)_副本.jpg

S200VPROH2B-IS200VPROH1BEF电源模块是可以直接贴装在印刷电路板上的电源供应器,其特点是可为专用集成电路(ASIC)、数字信号处理器 (DSP)、微处理器、存储器、现场可编程门阵列 (FPGA) 及其他数字或模拟负载提供供电。一般来说,这类模块称为负载点 (POL) 电源供应系统或使用点电源供应系统 (PUPS)。


S200VPROH2B-IS200VPROH1BEF电源模块广泛应用于交换设备、接入设备、移动通讯、微波通讯以及光传输、路由器等通信领域和汽车电子、航空航天等。S200VPROH2B-IS200VPROH1BEF由于采用模块组建电源系统具有设计周期短、可靠性高、系统升级容易等特点,S200VPROH2B-IS200VPROH1BEF电源模块的应用越来越广泛。随着半导体工艺、封装技术和高频软开关的大量使用,电源模块功率密度越来越大,转换效率越来越高,应用也越来越简单。

电源模块的分类方法有很多,以下是常见的几种:

- 按输入电压分:可分为高压模块和低压模块,高压模块通常为220V输入,低压模块有110V、24V、48V等多种输入电压。

- 按输出功率分:可分为小功率模块、中功率模块和大功率模块,不同功率的模块适用于不同的应用场景。

- 按封装形式分:可分为插针式模块、贴片式模块和插件式模块,不同封装形式的模块适用于不同的应用场景。

- 按输出类型分:可分为直流模块和交流模块,直流模块输出为直流电,交流模块输出为交流电。

- 按功能分:可分为线性电源模块和开关电源模块,线性电源模块输出纹波小,但效率较低,开关电源模块效率高,但输出纹波较大。


以上是电源模块的一些常见分类,不同类型的电源模块适用于不同的应用场景,具体选择需要根据实际需求进行选择。

S200VPROH2B-IS200VPROH1BEF 电源模块 用于交换设备、接入设备、移动通讯

GE-IS200VPROH2B-IS200VPROH1BEF-IS200VPWRH1AHD--(1)_副本.jpg


The S200VPROH2B-IS200VPROH1BEF power module is a power supply that can be mounted directly on the printed circuit board. It features power for application-specific integrated circuits (ASics), digital signal processors (DSPS), microprocessors, memory, field programmable gate arrays (FPgas), and other digital or analog loads. In general, such modules are called point-of-load (POL) power supply systems or point-of-use power supply systems (PUPS).


S200VPROH2B-IS200VPROH1BEF power module is widely used in switching equipment, access equipment, mobile communication, microwave communication, optical transmission, router and other communication fields, automotive electronics, aerospace and so on. S200VPROH2B-IS200VPROH1BEF The S200VPROH2B-IS200VPROH1BEF power module is more and more widely used because it has the characteristics of short design cycle, high reliability, and easy system upgrade. With the extensive use of semiconductor technology, packaging technology and high-frequency soft switches, the power density of power modules is increasing, the conversion efficiency is getting higher and higher, and the application is getting simpler and simpler.

There are many ways to classify power modules. The following are common ones:

- According to the input voltage: can be divided into high voltage module and low voltage module, high voltage module is usually 220V input, low voltage module has 110V, 24V, 48V and other input voltage.

- By output power: The system can be divided into low-power modules, medium-power modules, and high-power modules. Modules with different power levels are suitable for different application scenarios.

- By package type: It can be divided into pin module, chip module and plug-in module. Modules in different package forms are suitable for different application scenarios.

- By output type, the system can be divided into DC modules and AC modules. The DC module outputs DC power, and the AC module outputs AC power.

- By function: It can be divided into linear power module and switching power module. Linear power module has small output ripple but low efficiency, and switching power module has high efficiency but large output ripple.


The above lists the common categories of power modules. Different types of power modules are applicable to different application scenarios. You need to select power modules based on actual requirements.

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