IC690RBT001A  通用背板 用于支撑和固定电子设备或模块

描述:描述:IC695CHSO16-DR是一款PACSystem RX3i通用背板，以前由GE智能平台(GE IP)生产，现在属于艾默生自动化。该背板有12个插槽，支持安装基于pci的RX3i和系列90-30 I/O和可选模块。它有一个双母线背板，只支持水平安装方向。该背板具有隔离的24VDC输入和额定电流，在3.3 VDC为600 mA，在5 VDC为240 mA。

IC695CHSO16-DR 通用背板是一种通用的机械结构，用于支撑和固定电子设备或模块，并为其提供连接和通信接口。它可以用于各种不同的设备和应用场景，如服务器、网络设备、通信设备等。

IC695CHSO16-DR 通用背板的设计通常需要考虑以下几个方面：

连接性：IC695CHSO16-DR通用背板需要提供足够的连接接口，以满足设备或模块之间的连接需求。这些接口可以是电缆插口、卡槽、连接器等。

扩展性：通用背板应具有一定的扩展性，以适应未来设备的增加或更换。这通常涉及到背板的尺寸、接口数量和排列方式等。

可靠性：通用背板需要具有较高的可靠性，以保证设备的稳定性和可靠性。这涉及到背板的材料、结构和工艺等方面。

可维护性：IC695CHSO16-DR通用背板的设计应方便设备的维护和维修。这包括背板的拆卸、更换和升级等方面。

通用背板的设计和制造需要考虑到上述因素，并经过充分的技术验证和测试，以确保其性能和可靠性。同时，由于通用背板的应用范围广泛，其成本也需要得到有效的控制，以满足不同用户的需求。 是一款PACSystem RX3i通用背板，以前由GE智能平台(GE IP)生产，现在属于艾默生自动化。该背板有12个插槽，支持安装基于pci的RX3i和系列90-30 I/O和可选模块。它有一个双母线背板，只支持水平安装方向。该背板具有隔离的24VDC输入和额定电流，在3.3 VDC为600 mA，在5 VDC为240 mA。

IC695CHSO16-DR通用背板是一种通用的机械结构，用于支撑和固定电子设备或模块，并为其提供连接和通信接口。它可以用于各种不同的设备和应用场景，如服务器、网络设备、通信设备等。

IC690RBT001A  通用背板 用于支撑和固定电子设备或模块

Description: The IC695CHSO16-DR is a PACSystem RX3i universal backplane formerly manufactured by GE Intelligent Platforms (GE IP) and now owned by Emerson Automation. The backplane has 12 slots and supports the installation of PCI-based RX3i and series 90-30 I/O and optional modules. It has a dual bus backplane that supports horizontal mounting directions only. The backplane has an isolated 24VDC input and current rating of 600 mA at 3.3 VDC and 240 mA at 5 VDC.

The IC695CHSO16-DR Universal Backplane is a general-purpose mechanical structure used to support and hold electronic devices or modules and provide them with connectivity and communication interfaces. It can be used in a variety of different devices and application scenarios, such as servers, network devices, communication devices, etc.

The design of the IC695CHSO16-DR universal backplane usually needs to consider the following aspects:

Connectivity: The IC695CHSO16-DR universal backplane must provide sufficient interfaces to meet the connection requirements between devices or modules. These interfaces can be cable jacks, card slots, connectors, etc.

Expansibility: The universal backplane should have certain expansibility to adapt to the addition or replacement of future equipment. This usually involves the size of the backplane, the number of interfaces and the way it is arranged.

Reliability: A universal backplane has high reliability to ensure device stability and reliability. This involves the material, structure and process of the backplane.

Maintainability: The IC695CHSO16-DR universal backplane should be designed to facilitate the maintenance and repair of the equipment. This includes the removal, replacement and upgrade of the backplane.

Universal backplanes need to be designed and manufactured with the above factors in mind, and have undergone adequate technical validation and testing to ensure their performance and reliability. At the same time, due to the wide range of applications of universal backplane, its cost also needs to be effectively controlled to meet the needs of different users. It is a PACSystem RX3i universal backplane formerly manufactured by GE Intelligent Platforms (GE IP) and now owned by Emerson Automation. The backplane has 12 slots and supports the installation of PCI-based RX3i and series 90-30 I/O and optional modules. It has a dual bus backplane that supports horizontal mounting directions only. The backplane has an isolated 24VDC input and current rating of 600 mA at 3.3 VDC and 240 mA at 5 VDC.

The IC695CHSO16-DR Universal Backplane is a general-purpose mechanical structure used to support and hold electronic devices or modules and provide them with connectivity and communication interfaces. It can be used in a variety of different devices and application scenarios, such as servers, network devices, communication devices, etc.