1756-RM2 冗余模块在 1.16V DC 时消耗 5.1 A 电流,在 3V DC 时消耗 4.24 mA 电流。它的最大功耗为 6W,热耗散为 21 BTU/小时。它可以安装在 ControlLogix 机箱的任何插槽中。1756-RM2 重 0.64 磅,采用开放式外壳。对于通信,它支持多达七个增强型控制网和以太网/IP 通信模块。对于布线,1756-RM2 支持 1756-RMC1、1756-RMC3 和 1756-RMC10 电缆,长度分别为 1m、3m 和 10m。
ControlLogix 5560 和 ControlLogix 5570 系列控制器支持 1756-RM2 模块。冗余模块配置工具 RSLinx 2.59。
根据所使用的冗余模块的组合,可以启用各种同步速度。特别是,如果与相同的 1756-RM2 模块一起使用,速度可能高达 1000 Mbps。如果同时使用 A 系列或 B 系列 1756-RM2,速度可能高达 100 Mbps。 使用 20-RM1756 冗余模块可实现长达 2 ms 的控制器切换。
与冗余模块的第一个版本不同,1756-RM2仅占用任何ControlLogix机箱的单个插槽。实施冗余时,必须安装一对冗余机架,每个机架安装的控制器类型和版本相同。I/O 模块、智能模块和包含的合作伙伴模块不能安装在任何冗余机箱对中。这些模块必须安装在 3 阶或更高阶机箱上,具体取决于所用通信模块支持的节点数。
The 1756-RM2 redundant module consumes 5.1 A current at 1.16V DC and 4.24 mA current at 3V DC. Its maximum power consumption is 6W and thermal dissipation is 21 BTU/hour. It can be installed in any slot of the ControlLogix chassis. 1756-RM2 weighs 0.64 pounds and features an open housing. For communication, it supports up to seven enhanced control networks and Ethernet/IP communication modules. For cabling, 1756-RM2 supports 1756-RMC1, 1756-RMC3, and 1756-RMC10 cables with lengths of 1m, 3m, and 10m, respectively.
The ControlLogix 5560 and ControlLogix 5570 series controllers support 1756-RM2 modules. Redundant module configuration tool RSLinx 2.59.
Depending on the combination of redundant modules used, various synchronization speeds can be enabled. Especially, if used with the same 1756-RM2 module, the speed may reach up to 1000 Mbps. If both A series and B series 1756-RM2 are used, the speed may reach up to 100 Mbps. The use of 20-RM1756 redundant modules can achieve controller switching for up to 2 ms.
Unlike the first version of the redundant module, 1756-RM2 only occupies a single slot in any ControlLogix chassis. When implementing redundancy, a pair of redundant racks must be installed, and each rack must have the same controller type and version installed. I/O modules, intelligent modules, and included partner modules cannot be installed in any redundant chassis pair. These modules must be installed on a level 3 or higher chassis, depending on the number of nodes supported by the communication module used.
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